Insights into alleviating high brittleness of TiCu compound by doping C and O as interstitials: First-principle calculations
The highly brittle TiCu compound poses a significant threat to the reliability of Ti/Cu composite components, imposing limitations on their widespread application. In this work, a promising method for alleviating the brittleness of TiCu compounds through the introduction of interstitial carbon (C) a...
| 出版年: | Next Materials |
|---|---|
| 主要な著者: | , , , , , |
| フォーマット: | 論文 |
| 言語: | 英語 |
| 出版事項: |
Elsevier
2025-01-01
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| 主題: | |
| オンライン・アクセス: | http://www.sciencedirect.com/science/article/pii/S2949822824001989 |
