Insights into alleviating high brittleness of TiCu compound by doping C and O as interstitials: First-principle calculations

The highly brittle TiCu compound poses a significant threat to the reliability of Ti/Cu composite components, imposing limitations on their widespread application. In this work, a promising method for alleviating the brittleness of TiCu compounds through the introduction of interstitial carbon (C) a...

詳細記述

書誌詳細
出版年:Next Materials
主要な著者: Yujie Tao, Yibo Liu, Yue Liu, Qi Sun, Haoyu Kong, Qingjie Sun
フォーマット: 論文
言語:英語
出版事項: Elsevier 2025-01-01
主題:
オンライン・アクセス:http://www.sciencedirect.com/science/article/pii/S2949822824001989