Hydrogen‐Bond‐Mediated Surface Functionalization of Boron Nitride Micro‐Lamellae toward High Thermal Conductive Papers

Abstract Wide‐bandgap, layered hexagonal boron nitride (h‐BN) possesses excellent electrical insulation and ultrahigh thermal conductivity simultaneously, offering a perfect candidate for the growing demands of heating dissipations in modern chip industries and power electronics. Hybrids of h‐BN wit...

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出版年:	Advanced Materials Interfaces
主要な著者:	Shulei Yu, PeiChi Liao, Yilin Zhang, Yifei Li, Huifeng Tian, Ruijie Li, Shizhuo Liu, Zhixin Yao, Zhenjiang Li, Yihan Wang, Lina Yang Zhang, SASAKI U, Junjie Guo, Lifen Wang, Shulin Bai, Ji Chen, Xuedong Bai, Lei Liu
フォーマット:	論文
言語:	英語
出版事項:	Wiley-VCH 2023-04-01
主題:	boron nitride flexibility hydrogen bonds surface functionalization thermal conduction
オンライン･アクセス:	https://doi.org/10.1002/admi.202202196