Yu, S., Liao, P., Zhang, Y., Li, Y., Tian, H., Li, R., . . . Liu, L. (2023, April). Hydrogen‐Bond‐Mediated Surface Functionalization of Boron Nitride Micro‐Lamellae toward High Thermal Conductive Papers. Advanced Materials Interfaces.
Chicagoスタイル(17版)引用形式Yu, Shulei, et al. "Hydrogen‐Bond‐Mediated Surface Functionalization of Boron Nitride Micro‐Lamellae Toward High Thermal Conductive Papers." Advanced Materials Interfaces Apr. 2023.
MLA(9版)引用形式Yu, Shulei, et al. "Hydrogen‐Bond‐Mediated Surface Functionalization of Boron Nitride Micro‐Lamellae Toward High Thermal Conductive Papers." Advanced Materials Interfaces, Apr. 2023.
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