Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size

Nanoindentation morphologies of crystalline copper have been probed at the grain scale. Experimental tests have been conducted on nanocrystalline (NC), ultrafine-grained (UFG), and coarse-grained (CG) copper samples with a new Berkvoich indenter at the strain rate of 0.04/s without holding time at a...

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Bibliographic Details

Published in:	Crystals
Main Authors:	Jiangjiang Hu, Yusheng Zhang, Weiming Sun, Taihua Zhang
Format:	Article
Language:	English
Published:	MDPI AG 2017-12-01
Subjects:	nanoindentation pile-up effect grain size dislocation motion grain boundary activities
Online Access:	https://www.mdpi.com/2073-4352/8/1/9