An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding

This paper describes an experimental study of the cooling capabilities of microchannel and micro-pin-fin based on-chip cooling systems. The on-chip cooling systems integrated with a micro heat sink, simulated power IC (integrated circuit) and temperature sensors are fabricated by micromachining and...

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Bibliographic Details

Published in:	Sensors
Main Authors:	Yunlong Qiu, Wenjie Hu, Changju Wu, Weifang Chen
Format:	Article
Language:	English
Published:	MDPI AG 2020-09-01
Subjects:	power IC electronic cooling microchannel micro pin fin thermal resistance MEMS
Online Access:	https://www.mdpi.com/1424-8220/20/19/5533