Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults

Through-silicon via (TSV), responsible for inter-layer communication in high-bandwidth memory (HBM), plays a critical role in HBM operation. Therefore, faults occur in TSVs can critically impact the entire chips. However, due to their structural characteristics, TSVs are prone to faults occurring bo...

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Bibliographic Details

Published in:	IEEE Access
Main Authors:	Seokjun Jang, Donghyun Han, Sunghoon Kim, Dayoung Kim, Sungho Kang
Format:	Article
Language:	English
Published:	IEEE 2025-01-01
Subjects:	High-bandwidth memory (HBM) through-silicon via (TSV) repair highly clustered faults low-cost architecture
Online Access:	https://ieeexplore.ieee.org/document/10884753/