Thermal, Mechanical and Dielectric Properties of Polyimide Composite Films by In-Situ Reduction of Fluorinated Graphene

Materials with outstanding mechanical properties and excellent dielectric properties are increasingly favored in the microelectronics industry. The application of polyimide (PI) in the field of microelectronics is limited because of the fact that PI with excellent mechanical properties does not have...

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書誌詳細

出版年:	Molecules
主要な著者:	Yuyin Zhang, Tian Hu, Rubei Hu, Shaohua Jiang, Chunmei Zhang, Haoqing Hou
フォーマット:	論文
言語:	英語
出版事項:	MDPI AG 2022-12-01
主題:	polyimide fluorinated graphene composites dielectric properties
オンライン･アクセス:	https://www.mdpi.com/1420-3049/27/24/8896