Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu<sub>6</sub>Sn<sub>5</sub> Growth during Multiple Reflows
The multiple reflows process is widely used in 3D packaging in the field of electronic packaging. The growth behavior of interfacial intermetallic compound (IMC) is more important to the reliability of solder joints. In this paper, experimental measurement combined with simulation calculation were p...
| 出版年: | Metals |
|---|---|
| 主要な著者: | , , , , |
| フォーマット: | 論文 |
| 言語: | 英語 |
| 出版事項: |
MDPI AG
2021-12-01
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| 主題: | |
| オンライン･アクセス: | https://www.mdpi.com/2075-4701/11/12/2041 |