APA (7th ed.) Citation

Shang, M., Dong, C., Ma, H., Wang, Y., & Ma, H. (2021, December). Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu₆Sn₅ Growth during Multiple Reflows. Metals.

Chicago Style (17th ed.) Citation

Shang, Min, Chong Dong, Haoran Ma, Yunpeng Wang, and Haitao Ma. "Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu₆Sn₅ Growth During Multiple Reflows." Metals Dec. 2021.

MLA (9th ed.) Citation

Shang, Min, et al. "Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu₆Sn₅ Growth During Multiple Reflows." Metals, Dec. 2021.