| Summary: | The multiple reflows process is widely used in 3D packaging in the field of electronic packaging. The growth behavior of interfacial intermetallic compound (IMC) is more important to the reliability of solder joints. In this paper, experimental measurement combined with simulation calculation were preformed to investigate the evolution of Cu concentration in solders during multiple reflows, as well as its effects on the growth behavior of IMC and solder properties. The concentration of Cu in solder fluctuated, increasing with the increase of reflow times, which led to the fluctuation in the growth rate of the IMC. Furthermore, the Vickers hardness and melting point of the solder fluctuated during the multiple reflow processes due to the fluctuation in the Cu concentration. The data generated during this study could help to develop machine learning tools in relation to the study of interfacial microstructure evolution during multiple reflows.
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