Wafer Surface Defect Detection Based on Background Subtraction and Faster R-CNN

Concerning the problem that wafer surface defects are easily confused with the background and are difficult to detect, a new detection method for wafer surface defects based on background subtraction and Faster R-CNN is proposed. First, an improved spectral analysis method is proposed to measure the...

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Bibliographic Details

Published in:	Micromachines
Main Authors:	Jiebing Zheng, Tao Zhang
Format:	Article
Language:	English
Published:	MDPI AG 2023-04-01
Subjects:	defect detection background subtraction period measurement image reconstruction Faster R-CNN
Online Access:	https://www.mdpi.com/2072-666X/14/5/905