Growth Kinetics of Ni<sub>3</sub>Ga<sub>7</sub> in Ni/Ga System During Interfacial Reaction Diffusion

In order to apply Ga alloys to flexible and wearable electronic devices, it is crucial to verify the mechanical reliability of interconnections between Ga and various metal electrodes. This study investigated the phase transformation kinetics and microstructural evolution in the Ni/Ga couple. The di...

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Bibliographic Details
Published in:Crystals
Main Authors: Jun Peng, Tao Wang, Shuai Zhang
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Subjects:
Online Access:https://www.mdpi.com/2073-4352/15/6/520