FEM simulation of the size and constraining effect in lead free solder joints

Due to the ongoing miniaturization in microelectronics, the influence of dimensional constraining effects on the strength of solder joints becomes increasingly important. Detailed investigations show a strong dependence of tensile strength and ductility on solder geometry. This paper focuses on FEM...

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Bibliographic Details

Published in:	Applied and Computational Mechanics
Main Authors:	Lederer M., Khatibi G., Weiss B.
Format:	Article
Language:	English
Published:	University of West Bohemia 2012-06-01
Subjects:	Von Mises criterion Ductile fracture Solder joints
Online Access:	http://www.kme.zcu.cz/acm/index.php/acm/article/view/169/156