Wafer-Scale Polishing of Polycrystalline MPACVD-Diamond

Diamond offers great potential for use as a thermal spreader in various applications, including power electronics and radio-frequency (RF) applications. However, to be used as an efficient thermal spreader, the atomically smooth surface of the diamond is critical to be bonded with chips. Herein, a p...

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Bibliographic Details

Published in:	Surfaces
Main Authors:	Xuerun Huang, Changjie Zhou, Bo Wu, Zhiming Geng, Xing Zhang
Format:	Article
Language:	English
Published:	MDPI AG 2022-02-01
Subjects:	wafer-scale polycrystalline diamond polishing surface smoothing high efficiency
Online Access:	https://www.mdpi.com/2571-9637/5/1/8