Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package

This paper presents the mechanical behaviors of different types of polyimide feedthroughs that are frequently used for implantable polymer encapsulation. Implantable packages of electronic devices often comprise circuits mounted on printed circuit boards (PCBs) encapsulated in a biocompatible polyme...

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Bibliographic Details

Published in:	Micromachines
Main Authors:	Seonho Seok, HyungDal Park, Yong-Jun Kim, Jinseok Kim
Format:	Article
Language:	English
Published:	MDPI AG 2022-08-01
Subjects:	mechanical characterization polymer feedthroughs FEM (finite element method) implantable package tensile test
Online Access:	https://www.mdpi.com/2072-666X/13/8/1295