Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were designed to obtain different Joule heating propertie...

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Bibliographic Details

Published in:	Metals
Main Authors:	Yijie Gao, Keke Zhang, Chao Zhang, Yuming Wang, Weiming Chen
Format:	Article
Language:	English
Published:	MDPI AG 2023-08-01
Subjects:	Sn58Bi solder joint Joule heat electromigration interfacial IMC mechanical properties
Online Access:	https://www.mdpi.com/2075-4701/13/8/1475