Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint

A Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriate quantity of Ni nanoparticles can enhance the mic...

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Bibliographic Details

Published in:	Metals
Main Authors:	Yuchun Fan, Keke Zhang, Weiming Chen, Jinna Wu, Yonglei Wang
Format:	Article
Language:	English
Published:	MDPI AG 2024-12-01
Subjects:	Ni nanoparticles Sn58Bi composite solder lead-free solder joint thermomigration microstructure property
Online Access:	https://www.mdpi.com/2075-4701/14/12/1420