Feng, Y., Yu, H., Liu, W., Hu, K., Sun, S., Yang, Z., & Wang, B. (2024, May). Grooving and Absorption on Substrates to Reduce the Bulk Acoustic Wave for Surface Acoustic Wave Micro-Force Sensors. Micromachines.
Chicago Style (17th ed.) CitationFeng, Yang, Haoda Yu, Wenbo Liu, Keyong Hu, Shuifa Sun, Zhen Yang, and Ben Wang. "Grooving and Absorption on Substrates to Reduce the Bulk Acoustic Wave for Surface Acoustic Wave Micro-Force Sensors." Micromachines May. 2024.
MLA (9th ed.) CitationFeng, Yang, et al. "Grooving and Absorption on Substrates to Reduce the Bulk Acoustic Wave for Surface Acoustic Wave Micro-Force Sensors." Micromachines, May. 2024.
Warning: These citations may not always be 100% accurate.
