Reliability Analysis of Power IGBT Modules

Firstly, the module concept, packaging procedures, reliability and failure rules was presented. Then, the standard tests methodologies for investigating module reliability including endurance and environment tests were discussed. Lastly, the main failure mechanisms such as wire bonds failure, chip m...

Full description

Bibliographic Details

Published in:	机车电传动
Main Authors:	WANG Yan-gang, Jones Steve, LIU Guo-you
Format:	Article
Language:	Chinese
Published:	Editorial Department of Electric Drive for Locomotives 2013-01-01
Subjects:	IGBT module reliability reliability test failure mechanism life
Online Access:	http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2013.01.005