Reliability Analysis of Power IGBT Modules
Firstly, the module concept, packaging procedures, reliability and failure rules was presented. Then, the standard tests methodologies for investigating module reliability including endurance and environment tests were discussed. Lastly, the main failure mechanisms such as wire bonds failure, chip m...
| 出版年: | 机车电传动 |
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| 主要な著者: | , , |
| フォーマット: | 論文 |
| 言語: | 中国語 |
| 出版事項: |
Editorial Department of Electric Drive for Locomotives
2013-01-01
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| 主題: | |
| オンライン･アクセス: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2013.01.005 |
| 要約: | Firstly, the module concept, packaging procedures, reliability and failure rules was presented. Then, the standard tests methodologies for investigating module reliability including endurance and environment tests were discussed. Lastly, the main failure mechanisms such as wire bonds failure, chip metallization reconstruction, solder layer fatigue and substrate delamination were studied. |
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| ISSN: | 1000-128X |