Reliability Analysis of Power IGBT Modules
Firstly, the module concept, packaging procedures, reliability and failure rules was presented. Then, the standard tests methodologies for investigating module reliability including endurance and environment tests were discussed. Lastly, the main failure mechanisms such as wire bonds failure, chip m...
| Published in: | 机车电传动 |
|---|---|
| Main Authors: | , , |
| Format: | Article |
| Language: | Chinese |
| Published: |
Editorial Department of Electric Drive for Locomotives
2013-01-01
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| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2013.01.005 |
| _version_ | 1849488090342621184 |
|---|---|
| author | WANG Yan-gang Jones Steve LIU Guo-you |
| author_facet | WANG Yan-gang Jones Steve LIU Guo-you |
| author_sort | WANG Yan-gang |
| collection | DOAJ |
| container_title | 机车电传动 |
| description | Firstly, the module concept, packaging procedures, reliability and failure rules was presented. Then, the standard tests methodologies for investigating module reliability including endurance and environment tests were discussed. Lastly, the main failure mechanisms such as wire bonds failure, chip metallization reconstruction, solder layer fatigue and substrate delamination were studied. |
| format | Article |
| id | doaj-art-62ef221d7d6a4e0c9db5fbd2df2e47d9 |
| institution | Directory of Open Access Journals |
| issn | 1000-128X |
| language | zho |
| publishDate | 2013-01-01 |
| publisher | Editorial Department of Electric Drive for Locomotives |
| record_format | Article |
| spelling | doaj-art-62ef221d7d6a4e0c9db5fbd2df2e47d92025-08-20T03:09:28ZzhoEditorial Department of Electric Drive for Locomotives机车电传动1000-128X2013-01-015920910333Reliability Analysis of Power IGBT ModulesWANG Yan-gangJones SteveLIU Guo-youFirstly, the module concept, packaging procedures, reliability and failure rules was presented. Then, the standard tests methodologies for investigating module reliability including endurance and environment tests were discussed. Lastly, the main failure mechanisms such as wire bonds failure, chip metallization reconstruction, solder layer fatigue and substrate delamination were studied.http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2013.01.005IGBT modulereliabilityreliability testfailure mechanismlife |
| spellingShingle | WANG Yan-gang Jones Steve LIU Guo-you Reliability Analysis of Power IGBT Modules IGBT module reliability reliability test failure mechanism life |
| title | Reliability Analysis of Power IGBT Modules |
| title_full | Reliability Analysis of Power IGBT Modules |
| title_fullStr | Reliability Analysis of Power IGBT Modules |
| title_full_unstemmed | Reliability Analysis of Power IGBT Modules |
| title_short | Reliability Analysis of Power IGBT Modules |
| title_sort | reliability analysis of power igbt modules |
| topic | IGBT module reliability reliability test failure mechanism life |
| url | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2013.01.005 |
| work_keys_str_mv | AT wangyangang reliabilityanalysisofpowerigbtmodules AT jonessteve reliabilityanalysisofpowerigbtmodules AT liuguoyou reliabilityanalysisofpowerigbtmodules |