Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the problems associated with the growth formation of intermetallic compounds need further research, especially at high temperatures. This study investigates the doping of Bismuth into SAC305 in the various compositions...

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Bibliographic Details
Published in:Metals
Main Authors: Umair Ali, Hamza Khan, Muhammad Aamir, Khaled Giasin, Numan Habib, Muhammad Owais Awan
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Subjects:
lead-free solder
bismuth
microstructure
mechanical properties
thermal aging
Online Access:https://www.mdpi.com/2075-4701/11/7/1077

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https://www.mdpi.com/2075-4701/11/7/1077

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