Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device
This paper demonstrated a microwave-assisted solvent bonding method that uses organic solvent to seal the thermoplastic substrates with microwave assistance. This direct bonding is a simple and straightforward process that starts with solvent application followed by microwave irradiation without the...
| 出版年: | Micromachines |
|---|---|
| 主要な著者: | , , |
| フォーマット: | 論文 |
| 言語: | 英語 |
| 出版事項: |
MDPI AG
2022-07-01
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| 主題: | |
| オンライン･アクセス: | https://www.mdpi.com/2072-666X/13/7/1131 |