Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere
Formic acid (FA) atmosphere is promising to achieve chemical reduction at the oxidized surfaces of the solder and matrix material during soldering, replacing chemical flux being challenging as the continuous decrease in the pitch of solder bump in a three-dimensional integrated circuit. Although a p...
| الحاوية / القاعدة: | Journal of Materials Research and Technology |
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| المؤلفون الرئيسيون: | , , , , , , , , , |
| التنسيق: | مقال |
| اللغة: | الإنجليزية |
| منشور في: |
Elsevier
2022-11-01
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://www.sciencedirect.com/science/article/pii/S2238785422015952 |