Analysis and Hardening of SEGR in Trench VDMOS with Termination Structure
Single-event gate-rupture (SEGR) in the trench vertical double-diffused power MOSFET (VDMOS) occurs at a critical bias voltage during heavy-ion experiments. Fault analysis demonstrates that the hot spot is located at the termination of the VDMOS, and the gate oxide in the termination region has been...
| Published in: | Micromachines |
|---|---|
| Main Authors: | , , , , , , , |
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-03-01
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| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/3/688 |
