Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming

The thickness nonuniformity of an electroformed layer is a bottleneck problem for electroformed micro metal devices. In this paper, a new fabrication method is proposed to improve the thickness uniformity of micro gear, which is the key element of various microdevices. The effect of the thickness of...

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Bibliographic Details

Published in:	Micromachines
Main Authors:	Huan Wang, Jing Xie, Tao Fan, Dapeng Sun, Chaobo Li
Format:	Article
Language:	English
Published:	MDPI AG 2023-03-01
Subjects:	micro-electroforming thickness uniformity self-aligned lithography roughness
Online Access:	https://www.mdpi.com/2072-666X/14/4/775