Research on Baseplate Soldering Process of High-voltage IGBT Module

The solder layer between AlN substrate and AlSiC baseplate is a main way of heat dissipation for high-voltage IGBT module. Therefore, the void rate of the solder layer has a direct impact on the performance and reliability of high-voltage IGBT module. In this paper, using the SnAg free-lead solder p...

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Bibliographic Details

Published in:	Kongzhi Yu Xinxi Jishu
Format:	Article
Language:	Chinese
Published:	Editorial Office of Control and Information Technology 2011-01-01
Subjects:	IGBT module baseplate SnAg solder vacuum reflow soldering void rate
Online Access:	http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.03.003