Thermal Design and Simulation of 1 500 A/3 300 V IGBT Power Modulein Traction Applications

The thermal management of 1 500 A/3 300 V IGBT power module was developed in this paper. First, based on thermal nodes network, an equivalent circuit model for thermal resistance of power module was highlighted, from which the steady state thermal resistance was optimized theoretically. Then, therma...

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Bibliographic Details

Published in:	机车电传动
Main Authors:	LIU Guo-you, WU Yi-bo, XU Ning-hua, DOU Ze-chun
Format:	Article
Language:	Chinese
Published:	Editorial Department of Electric Drive for Locomotives 2013-01-01
Subjects:	power module IGBT thermal resistance analysis node model
Online Access:	http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2013.01.002