Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent

The use of additives facilitates the deposition of copper on metal substrates.In this work，using choline chloride glacial acetic acid(Ch Cl-Gl A) as a low eutectic solvent and copper acetate as the main salt， the effects of ascorbic acid(C6H8O6)， disodium ethylenediamine tetraacetic acid(EDTA-2Na) a...

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Bibliographic Details

Published in:	Cailiao Baohu
Main Author:	LIU Yang, HAO Jianjun, YIN Hongkun, WANG Xinhui
Format:	Article
Language:	Chinese
Published:	Editorial Department of Materials Protection 2024-12-01
Subjects:	electrodeposited copper； low eutectic solvent； additives； cyclic voltammetry
Online Access:	http://www.mat-pro.com/fileup/1001-1560/PDF/20241202.pdf