Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a th...

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Bibliographic Details

Published in:	Micromachines
Main Authors:	Yanan Yu, Yafei Yin, Yuhang Li, Min Li, Jizhou Song
Format:	Article
Language:	English
Published:	MDPI AG 2021-09-01
Subjects:	thermal analysis flow channel active heat dissipation flexible electronics
Online Access:	https://www.mdpi.com/2072-666X/12/10/1165