Research on Crystal Structure Evolution and Failure Mechanism during TSV-Metal Line Electromigration Process

The combined use of Through Silicon Via (TSV) and metal lines, referred to as TSV-metal lines, is an essential structure in three-dimensional integrated circuits. In-depth research into the electromigration failure mechanism of TSV and the microstructure evolution can serve as theoretical guidance f...

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Bibliographic Details

Published in:	Crystals
Main Authors:	Tao Gong, Liangliang Xie, Si Chen, Xiangjun Lu, Mingrui Zhao, Jianyuan Zhu, Xiaofeng Yang, Zhizhe Wang
Format:	Article
Language:	English
Published:	MDPI AG 2023-12-01
Subjects:	TSV electromigration electron backscattered diffraction failure mechanisms
Online Access:	https://www.mdpi.com/2073-4352/14/1/37