Application of Silver Sintering Technology in Press-pack IGBTs

Silver sintering technology which has the characteristics of low temperature connection, low thermal resistance, low stress and high melting point, has gradually become the application trend of interface reliability-connection in insulated gate bipolar transistors(IGBT). The mechanism of silver sint...

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Bibliographic Details

Published in:	机车电传动
Main Authors:	Tingchang SHI, Han LI, Guiqin CHANG, Haihui LUO, Guozhong DONG, Guoyou LIU
Format:	Article
Language:	Chinese
Published:	Editorial Department of Electric Drive for Locomotives 2021-09-01
Subjects:	silver sintering technology press-pack IGBT reliability FEA (finite element analysis)
Online Access:	http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.020