Series-Fed Microstrip Patch Antenna Array with Additive-Manufactured Foldable Honeycomb-Shaped Substrate

This paper presents a novel foldable S-band microstrip patch antenna array operating in the 2.4–2.45 GHz band. The substrate is designed to allow the array to be folded and arranged in tiles, forming a versatile, reconfigurable antenna array. Additive manufacturing is used to fabricate the substrate...

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Bibliographic Details

Published in:	Micromachines
Main Authors:	Sima Noghanian, Yi-Hsiang Chang, Patricio Guerron, Reena Dahle
Format:	Article
Language:	English
Published:	MDPI AG 2024-11-01
Subjects:	foldable antenna 3D-printed antenna microstrip antenna hinge
Online Access:	https://www.mdpi.com/2072-666X/15/12/1449