Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate...

وصف كامل

التفاصيل البيبلوغرافية

الحاوية / القاعدة:	Nanomaterials
المؤلفون الرئيسيون:	Jenn-Ming Song, Bo-Chang Huang, David Tarng, Chih-Pin Hung, Kiyokazu Yasuda
التنسيق:	مقال
اللغة:	الإنجليزية
منشور في:	MDPI AG 2020-07-01
الموضوعات:	solder joint intermetallic compounds nanoindentation impact test
الوصول للمادة أونلاين:	https://www.mdpi.com/2079-4991/10/8/1456