A Novel Noise Reduction Approach of Acoustic Emission (AE) Signals in the SiC Lapping Process on Fixed Abrasive Pads

Acoustic emission (AE) technology has been widely utilized to monitor the SiC wafer lapping process. The root-mean-square (RMS) of the time–domain eigenvalues of the AE signal has a linear relationship with the material removal rate (MRR). However, the existence of background noise severely reduces...

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Bibliographic Details

Published in:	Micromachines
Main Authors:	Jie Lin, Jiapeng Chen, Wenkun Lin, Anjie He, Xiaodong Hao, Zhenlin Jiang, Wenjun Wang, Baoxiu Wang, Kerong Wang, Ying Wei, Tao Sun
Format:	Article
Language:	English
Published:	MDPI AG 2024-07-01
Subjects:	acoustic emission noise reduction frequency threshold wavelet packet spectral subtraction fixed abrasive lapping
Online Access:	https://www.mdpi.com/2072-666X/15/7/900