Copper-Electroplating-Modified Liquid Metal Microfluidic Electrodes

Here, we report a novel technology for the fabrication of copper-electroplating-modified liquid metal microelectrodes. This technology overcomes the complexity of the traditional fabrication of sidewall solid metal electrodes and successfully fabricates a pair of tiny stable solid-contact microelect...

詳細記述

書誌詳細

出版年:	Sensors
主要な著者:	Jiahao Gong, Bingxin Liu, Pan Zhang, Huimin Zhang, Lin Gui
フォーマット:	論文
言語:	英語
出版事項:	MDPI AG 2022-02-01
主題:	electroplating liquid metal microelectrodes capacitive sensing
オンライン･アクセス:	https://www.mdpi.com/1424-8220/22/5/1820