Ultrasonic non-destructive evaluation study of molecular diffusion bonding of thin copper-aluminum electrode sheets

The weld quality of copper and aluminum thin electrode sheets in molecular diffusion bonding was non-destructively evaluated using ultrasonic resonance techniques. During the welding process, the intermediate layer material nickel diffuses into the molecules of both the copper sheet and aluminum she...

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Bibliographic Details

Published in:	Materials Research Express
Main Authors:	Shengtao Li, Huaishu Hou, Han Yun, Jinhao Li
Format:	Article
Language:	English
Published:	IOP Publishing 2024-01-01
Subjects:	copper-aluminum thin electrode sheets ultrasonic resonance method acoustic attenuation coefficient molecular diffusion bonding
Online Access:	https://doi.org/10.1088/2053-1591/ad2bb2