Li, S., Hou, H., Yun, H., & Li, J. (2024, January). Ultrasonic non-destructive evaluation study of molecular diffusion bonding of thin copper-aluminum electrode sheets. Materials Research Express.
Chicago Style (17th ed.) CitationLi, Shengtao, Huaishu Hou, Han Yun, and Jinhao Li. "Ultrasonic Non-destructive Evaluation Study of Molecular Diffusion Bonding of Thin Copper-aluminum Electrode Sheets." Materials Research Express Jan. 2024.
MLA (9th ed.) CitationLi, Shengtao, et al. "Ultrasonic Non-destructive Evaluation Study of Molecular Diffusion Bonding of Thin Copper-aluminum Electrode Sheets." Materials Research Express, Jan. 2024.
Warning: These citations may not always be 100% accurate.