Experimental evaluation on the silicon mechanical performance of electronic packaging

Semiconductor packaging is trending towards a miniaturisation in size but an increase in functionality. Hence, the thickness of the silicon wafer has decreased dramatically with a concern on the possible degradation of the strength of the thinned wafer. In this paper, 3point bend (3PB) on bare silic...

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發表在:	Journal of Mechanical Engineering and Sciences
Main Authors:	W. Fong, K.L. Koay, I.A. Azid
格式:	Article
語言:	英语
出版:	Universiti Malaysia Pahang Publishing 2017-03-01
主題:	semiconductor package silicon break strength 3-point bend reliability mechanical performance laser marking
在線閱讀:	https://journal.ump.edu.my/jmes/article/view/7991