Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures

Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules. However, suppressing the surface Fresnel reflection losses is challenging for wafer-level microlens arrays. Traditional dielectric...

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Bibliographic Details
Published in:Nanomaterials
Main Authors: Shuping Xie, Xinjun Wan, Bo Yang, Wei Zhang, Xiaoxiao Wei, Songlin Zhuang
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Subjects:
Online Access:https://www.mdpi.com/2079-4991/9/5/747