Thermal Characterization Methods of Novel Substrate Materials Utilized in IGBT Modules

In this article, thermal investigation methods for electrically insulating and thermally conductive substrate materials will be presented. The investigations were performed in their real-world application environment, i.e., in the form of IGBT (insulated gate bipolar transistor) module substrate pla...

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Bibliographic Details

Published in:	Electronic Materials
Main Authors:	János Hegedüs, Péter Gábor Szabó, László Pohl, Gusztáv Hantos, Gyula Lipák, Andrea Reolon, Ferenc Ender
Format:	Article
Language:	English
Published:	MDPI AG 2025-07-01
Subjects:	insulated gate bipolar transistor IGBT direct bonded copper DBC insulated metal substrate IMS
Online Access:	https://www.mdpi.com/2673-3978/6/3/9