Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates

Cu-based alloys are one of the most promising substrates to enhance the performance of lead-frame materials. In the present study, the interfacial reactions in the Sn-0.7 wt.% Cu (SC) lead-free solder reacting with Cu-3.3 wt.% Fe (C194), Cu-2.0 wt.% Be (Alloy 25), and Cu-3.3 wt.% Ti (C1990 HP) were...

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Bibliographic Details

Published in:	Metals
Main Authors:	Andromeda Dwi Laksono, Tzu-Yang Tsai, Tai-Hsuan Chung, Yong-Chi Chang, Yee-Wen Yen
Format:	Article
Language:	English
Published:	MDPI AG 2022-12-01
Subjects:	interfacial reaction Sn-0.7 wt.% Cu (SC) lead-free solder C194 Alloy 25 C1990 HP
Online Access:	https://www.mdpi.com/2075-4701/13/1/12