Pre-Ball-Milled Boron Nitride for the Preparation of Boron Nitride/Polyetherimide Nanocomposite Film with Enhanced Breakdown Strength and Mechanical Properties for Thermal Management

Modern electronics not only require the thermal management ability of polymer packaging materials but also need anti-voltage and mechanical properties. Boron nitride nanosheets (BNNS), an ideal thermally conductive and high withstand voltage (800 kV/mm) filler, can meet application needs, but the co...

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Bibliographic Details

Published in:	Nanomaterials
Main Authors:	Ruiyi Li, Xiao Yang, Jian Li, Ding Liu, Lixin Zhang, Haisheng Chen, Xinghua Zheng, Ting Zhang
Format:	Article
Language:	English
Published:	MDPI AG 2022-10-01
Subjects:	polymer composites boron nitride nanosheets thermal conductivity breakdown strength mechanical properties
Online Access:	https://www.mdpi.com/2079-4991/12/19/3473