Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

In advanced packaging schemes, such as fan-out integration technology, photosensitive polyimide (PSPI) is the key material to the fabrication of panel level redistribution-layer (RDL). However, a large mismatch of coefficient of thermal expansion (CTE) between silicon (Si) and PSPI will cause seriou...

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Bibliographic Details
Published in:IEEE Journal of the Electron Devices Society
Main Authors: Yuan-Chiu Huang, Han-Wen Hu, Yun-Hsi Liu, Hui-Ching Hsieh, Kuan-Neng Chen
Format: Article
Language:English
Published: IEEE 2024-01-01
Subjects:
enhancement
advanced packaging
RDL fabrication
Online Access:https://ieeexplore.ieee.org/document/10415013/

Internet

https://ieeexplore.ieee.org/document/10415013/

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