APA (7th ed.) Citation

Huang, Y., Hu, H., Liu, Y., Hsieh, H., & Chen, K. (2024, January). Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications. IEEE Journal of the Electron Devices Society.

Chicago Style (17th ed.) Citation

Huang, Yuan-Chiu, Han-Wen Hu, Yun-Hsi Liu, Hui-Ching Hsieh, and Kuan-Neng Chen. "Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications." IEEE Journal of the Electron Devices Society Jan. 2024.

MLA (9th ed.) Citation

Huang, Yuan-Chiu, et al. "Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications." IEEE Journal of the Electron Devices Society, Jan. 2024.