Thinning technology of MgO substrate for diamond growth by laser slicing

We tried laser slicing of (100) MgO wafer used as a substrate for heteroepitaxial growth of single crystal diamond. The laser slicing was successful by irradiating the inside of the material with an ultrashort pulse laser and generating a {100} cleavage. However, it was clarified that the cleavage o...

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Bibliographic Details

Published in:	Nihon Kikai Gakkai ronbunshu
Main Authors:	Yohei YAMADA, Junichi IKENO, Hideki SUZUKI, Hitoshi NOGUCHI
Format:	Article
Language:	Japanese
Published:	The Japan Society of Mechanical Engineers 2021-03-01
Subjects:	laser slicing mgo diamond semiconductor ultrashort pulse laser
Online Access:	https://www.jstage.jst.go.jp/article/transjsme/87/896/87_21-00022/_pdf/-char/en