Investigation of the Connection Schemes between Decks in 3D NAND Flash

Dual-deck stacking technology is an effective solution for solving the contradiction between the demand for increasing storage layers and the challenge of the deep hole etching process in 3D NAND flash. The connection scheme between decks is a key technology for the dual-deck structure. It has becom...

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Bibliographic Details

Published in:	Micromachines
Main Authors:	Jianquan Jia, Lei Jin, Kaikai You, Anyi Zhu
Format:	Article
Language:	English
Published:	MDPI AG 2023-09-01
Subjects:	3D NAND dual-deck connection scheme poly-plug device reliability
Online Access:	https://www.mdpi.com/2072-666X/14/9/1779