Detecting and Measuring Defects in Wafer Die Using GAN and YOLOv3

This research used deep learning methods to develop a set of algorithms to detect die particle defects. Generative adversarial network (GAN) generated natural and realistic images, which improved the ability of you only look once version 3 (YOLOv3) to detect die defects. Then defects were measured b...

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Bibliographic Details

Published in:	Applied Sciences
Main Authors:	Ssu-Han Chen, Chih-Hsiang Kang, Der-Baau Perng
Format:	Article
Language:	English
Published:	MDPI AG 2020-12-01
Subjects:	wafer die defect detection generative adversarial network (GAN) you only look once version 3 (YOLOv3)
Online Access:	https://www.mdpi.com/2076-3417/10/23/8725