Effect of Pulse Current on Interface Microstructure and Bonding Properties of TA1/304 Double-Layer Clad plates

Abstract It is difficult to effectively improve the low bonding strength of TA1/304 clad plates. This study proposes a new process for applying pulse current (1500 A, 500 Hz, 50% duty cycle) to TA1/304 clad plates during the rolling process, which changes the interface microstructure and effectively...

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Bibliographic Details

Published in:	Chinese Journal of Mechanical Engineering
Main Authors:	Xiongwei Guo, Zhongkai Ren, Pengjie Zhang, Chao Zhang, Shuyong Jiang, Qi Zhang, Tao Wang, Qingxue Huang
Format:	Article
Language:	English
Published:	SpringerOpen 2024-10-01
Subjects:	TA1/304 clad plates Electrically-assisted rolling (EAR) Element diffusion Microstructure Tensile shear strength
Online Access:	https://doi.org/10.1186/s10033-024-01097-3