Development of 8-inch Key Processes for Insulated-Gate Bipolar Transistor

Based on the construction of the 8-inch fabrication line, advanced process technology of 8-inch wafer, as well as the fourth-generation high-voltage double-diffused metal-oxide semiconductor (DMOS+) insulated-gate bipolar transistor (IGBT) technology and the fifth-generation trench gate IGBT technol...

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書目詳細資料
發表在:Engineering
Main Authors: Guoyou Liu, Rongjun Ding, Haihui Luo
格式: Article
語言:英语
出版: Elsevier 2015-09-01
主題:
在線閱讀:http://www.sciencedirect.com/science/article/pii/S2095809916300133
實物特徵
總結:Based on the construction of the 8-inch fabrication line, advanced process technology of 8-inch wafer, as well as the fourth-generation high-voltage double-diffused metal-oxide semiconductor (DMOS+) insulated-gate bipolar transistor (IGBT) technology and the fifth-generation trench gate IGBT technology, have been developed, realizing a great-leap forward technological development for the manufacturing of high-voltage IGBT from 6-inch to 8-inch. The 1600 A/1.7 kV and 1500 A/3.3 kV IGBT modules have been successfully fabricated, qualified, and applied in rail transportation traction system.
ISSN:2095-8099